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Reaching a New Era of Engineering at the ANSYS Electronics Simulation Expo



Backed by HPC technologies, M&E companies can take advantage of optimized tools such as 3D modeling and simulation software that work to accelerate the product design process.

Today’s enterprises are reliant on the latest IT innovations to maintain their competitive edge. High performance computing (HPC) for manufacturing and engineering (M&E) is revolutionizing the industry, equipping users to design, test, and bring products to market faster and more efficiently than ever. Among theEnggSimBlog.jpgse breakthrough capabilities, HPC simulation tools are helping engineers optimize the product development process and enhance the quality of their products and electronic services—while eliminating the need for a variety of costly prototypes.

Time is business-critical for adapting to evolving industry and customer requirements. In order to succeed, IT departments must adopt HPC technologies to satisfy these demands quickly and effectively, without exceeding IT budgets. HPC is laying the groundwork for a scalable, agile, and affordable IT environment. And with the added performance of simulation capabilities, M&E companies can operate with confidence by ensuring high-quality results and the fastest possible time to market.


Backed by HPC, engineers can take advantage of tools such as 3D modeling and simulation that work to accelerate the product design process. At Hewlett Packard Enterprise (HPE), our goal is to help customers expand their simulation capabilities to face the challenges of tomorrow. With industry-leading solutions expressly designed for M&E companies, users can achieve fast, accurate, and reliable simulations to boost productivity and increase cost-efficiencies.

Over the past 10 years, these techniques have dramatically reduced operational costs and replaced time-consuming processes with computer-generated models. Innovations like ANSYS simulation technologies are enabling users to reduce design time and cut costs as well as optimize electronic system performance, thanks to the right compute to support a variety of workloads. ANSYS simulations benefit engineers in several ways:

  • Designed to support simulation workloads as enterprises grow
  • Reduce runtime and improve productivity by supporting multiple simulations at one time
  • Effectively allocate compute resources
  • Easy to deploy, configure, and operate

Utilizing ANSYS technologies, customers can reduce design cycle time by 40 percent and increase the efficiency of parallel processing by 90 percent, yielding $44 of profit for every $1 invested in HPC. In one case study, Dasher Technologies was looking for a solution that was easy to deploy and manage, and would scale to accommodate future growth. This turnkey simulation software enabled the enterprise to run more jobs, faster, allowing them to spend less time prototyping and more time focusing on customer needs.


The ANSYS Electronics Simulation Expo is an international conference that focuses on enhancing virtual prototyping to develop electronics. These products—including power electronics, control systems, wireless systems, semiconductors, and process control blocks—require complex models and highly accurate virtual testing to achieve optimal performance and reliability. Electronic systems have the ability to power smart cities, healthcare devices, automotive electronics, and more, making HPC simulation a critical success factor.

The Expo returns this October in Tokyo, where over 1,000 industry experts will learn how global companies are developing innovative products through engineering simulation. The event kicks off October 5th with ANSYS Day 2017 which will feature Red Bull Racing, expert lectures—including a presentation by Platinum Sponsor HPE, and 43 sessions where global leaders and customers will discuss “beyond innovation to the new era of engineering.” On October 6th, executives who receive an invitation can attend a technical presentation regarding overseas trends in the automobile industry.

To learn more about the latest innovations in HPC, please follow me on Twitter at @Bill_Mannel. And for more information on how HPC-driven simulation can enhance your M&E operations, check out @HPE_HPC.

Bill Mannel
VP & GM - HPC & AI Segment Solutions

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About the Author


As the Vice President and General Manager of HPC and AI Segment Solutions in the Data Center Infrastructure Group, I lead worldwide business and portfolio strategy and execution for the fastest growing market segments in HPE’s Data Center Infrastructure Group which includes the recent SGI acquisition and the HPE Apollo portfolio.